- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 107/00 - Four or more poles
Patent holdings for IPC class H01R 107/00
Total number of patents in this class: 1958
10-year publication summary
162
|
305
|
468
|
366
|
251
|
179
|
112
|
78
|
33
|
8
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1034 |
234 |
Advanced Connectek Inc. | 338 |
87 |
Samsung Electronics Co., Ltd. | 131630 |
62 |
Molex, LLC | 1792 |
49 |
Lotes Co., Ltd. | 346 |
48 |
Japan Aviation Electronics Industry, Limited | 1585 |
45 |
Apple Inc. | 50209 |
42 |
TE Connectivity Solutions GmbH | 2580 |
42 |
CommScope Technologies LLC | 4937 |
38 |
Medtronic, Inc. | 9964 |
35 |
Yazaki Corporation | 6282 |
34 |
Sumitomo Wiring Systems, Ltd. | 9367 |
32 |
Panduit Corp. | 1007 |
26 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
26 |
May Patents Ltd. | 124 |
22 |
Guangdong Oppo Mobile Telecommunications Corp., Ltd. | 18739 |
20 |
Microsoft Technology Licensing, LLC | 51439 |
16 |
Sumitomo Electric Industries, Ltd. | 14131 |
13 |
Intel Corporation | 45621 |
13 |
Cisco Technology, Inc. | 18858 |
13 |
Other owners | 1061 |